Aplikasi saka Copper Foil ing Chip Packaging

Foil Tembagais becoming increasingly important in chip packaging due to its electrical conductivity, thermal conductivity, processability, and cost-effectiveness. Mangkene analisa rinci babagan aplikasi khusus ing chip kemil:

1. Ikatan kabel tembaga

• Ganti kanggo Kawat Emas utawa Aluminium
• Kinerja listrik sing ditingkatake: Copper wire bonding offers lower resistance and better thermal conductivity in high-frequency and high-current applications, effectively reducing power loss in chip interconnections and improving overall electrical performance. Mangkono, nggunakake foil Copper minangka bahan konduktif ing proses ikatan bisa nambah efisiensi kemasan lan linuwih tanpa nambah biaya.
• Digunakake ing elektrods lan mikro-nabrak: In flip-chip packaging, the chip is flipped so that the input/output (I/O) pads on its surface are directly connected to the circuit on the package substrate. Foil tembaga digunakake kanggo nggawe elektrods lan mikro-nabrak, sing didol langsung menyang landasan. Rintangan termal lan konduktivitas tembaga sing dhuwur kanggo panentu sinyal lan kekuwatan sing efisien.
• Linuwih lan manajemen termal
• Bahan pigura tim: Foil TembagaDigunakake kanthi akeh ing kemasan bingkai Lead, utamane kanggo kemasan piranti listrik. The lead frame provides structural support and electrical connection for the chip, requiring materials with high conductivity and good thermal conductivity. Capper foil ketemu karo syarat kasebut, kanthi efektif nyuda biaya kemasan nalika nambah dissipasi termal lan kinerja listrik.
• Teknik perawatan permukaan: In practical applications, copper foil often undergoes surface treatments such as nickel, tin, or silver plating to prevent oxidation and improve solderability. Pangobatan kasebut luwih lengkap nambah daya tahan lan keandalan tembaga ing kemasan bingkai timbal.
• Materi konduktif ing modul multi-chip: System-in-package technology integrates multiple chips and passive components into a single package to achieve higher integration and functional density. Foil tembaga digunakake kanggo nggawe sirkuit interconnecting internal lan dadi dalan konduksi sing saiki. This application requires copper foil to have high conductivity and ultra-thin characteristics to achieve higher performance in limited packaging space.
• Aplikasi Rf lan Millimeter gelombang
• Digunakake ing Lapisan Redistribusi (RDL): Ing kemasan penggemar, tembaga digunakake kanggo mbangun lapisan redistribution, teknologi sing nyedhiakake chip i / o menyang wilayah sing luwih gedhe. The high conductivity and good adhesion of copper foil make it an ideal material for building redistribution layers, increasing I/O density and supporting multi-chip integration.
• Pengurangan ukuran lan integritas sinyal
• Panas tembaga cemlorot lan saluran termal
• Digunakake ing liwat silikon liwat (TSV) teknologi

2. Kemasan flip-chip

3. Kemasan bingkai lead

4. Sistem-in-paket (sip)

5. Kemasan penggemar

6. Manajemen termal lan pemisahan panas

7. Teknologi packaging majeng (kayata bungkusan 2.5d lan 3D)